• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Housing comprising a support plate (2) having a front face; at least one electronic chip (6) mounted on the front face of the support plate; and an encapsulation cap (9) of the electronic chip, comprising a front wall (10) extending in front of the microchip and a peripheral wall (11) having an end edge attached to a peripheral zone of the chip. support plate, the support plate and the encapsulation cover delimiting at least one chamber (13) in which the electronic chip is located; at least one local slot (17) being arranged between the peripheral wall of the encapsulation cover and the support plate and having an outer opening and an inner opening opening into said chamber, so as to put said chamber in communication with the outside .
    公开号:FR3066643A1
    申请号:FR1754298
    申请日:2017-05-16
    公开日:2018-11-23
    发明作者:Marika Sorrieul
    申请人:STMicroelectronics Grenoble 2 SAS；
    IPC主号:
    专利说明:

    Electronic unit provided with a local slot forming a vent
    Embodiments of the present invention relate to the field of enclosures, in particular those intended to contain electronic chips, which can for example be designated by abuse of language by the expression "electronic enclosures".
    According to one embodiment, there is provided a housing which comprises a support plate having a front face; at least one electronic chip mounted on the front face of the support plate; and a cover for encapsulating the electronic chip, comprising a front wall extending in front of the electronic chip and a peripheral wall having an end edge fixed to a peripheral zone of the support plate, the support plate and the encapsulation cover delimiting at least one chamber in which the electronic chip is located.
    At least one local slot is arranged between the peripheral wall of the encapsulation cover and the support plate and has an external opening and an internal opening opening into said chamber, so as to put said chamber and the outside into communication.
    Thus, said local slot can make it possible to avoid an overpressure of gas in said chamber.
    A bead of fixing glue can be interposed between the end edge of the peripheral wall of the encapsulation cover and said peripheral zone of the support plate, this bead having a local interruption including said local slot.
    Said local slot may include a local groove provided in the support plate and / or a groove provided in the end edge of the peripheral wall of the encapsulation cover.
    At least one interior wall can be provided, this wall being located between the chip and the interior opening of said local slot.
    Said low wall can constitute an at least partial obstacle to the diffusion in the room of the light coming from the local slit.
    Said low wall can be provided projecting from the front face of the support plate.
    Said low wall may have ends joined at two locations spaced from the peripheral wall of the encapsulation cover, these two spaced locations being located on either side of said local slot.
    The front edge of said low wall can be located in front of the front edge of said local slot.
    Said low wall may include a bead of glue extending over the front face of the support plate.
    Said chip can be provided in its front face with at least one optical sensor, the front wall of the encapsulation cover having at least one through orifice and being provided with an optical element obstructing this orifice and allowing light to pass through.
    Then, said low wall can constitute an obstacle at least partial to the diffusion in said chamber of the light possibly coming from the local slit towards said optical sensor.
    Said chip can be provided in its front face with two optical sensors, said encapsulation cover being provided with an internal partition separating two cavities in said chamber, inside which said sensors are located; a chip provided with a light emitter can be placed in one of said cavities; and said front wall of the encapsulation cover may have through orifices situated on either side of the internal partition and may be provided with optical elements respectively obstructing these orifices and allowing light to pass through.
    A box will now be described by way of nonlimiting example, illustrated by the drawing in which:
    Figure 1 shows a median longitudinal section of a housing, perpendicular to a support plate, according to I-I of Figure 2;
    Figure 2 shows a flat section of the housing of Figure
    1, parallel to the support plate, according to II-II of Figure i;
    3 shows a local section of a corner of the housing, perpendicular to the support plate, according to III-III of Figure 2; and Figure 4 shows a top view of the support plate, before assembly.
    In Figures 1 to 3 is illustrated a housing 1 which comprises a support plate 2, made of a dielectric material, including an integrated network of electrical connections 3 and having a rear face 4 and a front mounting face 5. The outline of the support plate 2 is for example square or rectangular.
    The housing 1 comprises an electronic chip 6 mounted above the front face 5 of the support plate 2, by means of a layer of adhesive 7 interposed between the front face 5 of the support plate 2 and a face rear 6a of the chip 6. The periphery of the electronic chip 6 is at a distance from the periphery of the support plate 2.
    The chip 6 is electrically connected to the network of connections 3 by means of electrical connection wires 8 connecting studs on the front face 5 of the support plate 2 and studs on the front face 6b of the chip 6, the face rear 4 of the support plate 2 being provided with electrical connection pads (not shown) for external electrical connections of the connection network 3.
    The housing 1 comprises a cover 9 for encapsulating the chip 6 and electrical connection wires 8 in front of the support plate 2.
    The encapsulation cover 9 is cup-shaped and comprises a front wall 10 situated above and at a distance from the chip 6, parallel to the support plate 2, and a peripheral wall 11 which extends towards the rear from the front wall 10 and whose end edge 12 is adjacent to a peripheral zone of the front face of the support plate 2. The contour of the peripheral wall 11 of the peripheral wall 11 corresponds substantially to that of the plate support 2.
    Thus, the support plate 2 and the encapsulation cover 9 delimit a chamber 13 inside which the chip 6 and the wires 8 are located.
    The encapsulation cover 9 is fixed to the support plate 2 by means of a bead of adhesive 14 interposed between the end edge 12 of the peripheral wall 11 and the peripheral zone of the front face 5 of the plate support 2.
    The bead of adhesive 14 is interrupted for example in the vicinity of a corner of the support plate 2 and has ends 15 and 16 located at a distance from each other, so as to provide a local through slot 17, free of glue, between a local area of the support plate and a local area of the end edge 12 of the peripheral wall 11 of the encapsulation cover 9.
    The local slot 17 has an internal opening and an external opening, so that the local slot 17 opens on the one hand into the chamber 13 and on the other hand towards the outside and establishes a communication between the internal chamber 13 and the outside, forming a vent.
    Thus, the local slot 17 makes it possible to avoid any gas overpressure in the chamber 13, which everywhere else is closed, or in an otherwise closed part of the chamber 13, into which the local slot 17 opens.
    The housing 1 may be subjected to temperature increases, causing increases in the temperature of the gas contained in the chamber 13, in particular during the hardening of the bead of glue 14, which can cause degassing, during the fixing of elements complementary to the housing 14 by means of an adhesive or during assembly of the housing on a printed circuit board by means of fixing and electrical connection welds between the rear face 4 and this printed circuit board.
    The local slot 17 makes it possible to prevent elevations in the temperature of the gas from turning into overpressures in the chamber 13 which could create tearing forces of the encapsulation cover 9 relative to the support plate 2, which could partially destroy, in the form of cracks, or completely the connection by a continuous bead of glue 14.
    The local slot 17 includes a local enlargement groove 18 arranged in the front face 5 of the support plate 2. The local groove 17 extends from the edge of the support plate 2 to a place located in the chamber 13, at a short distance beyond the internal face of the peripheral wall 11 of the encapsulation cover 9.
    The local slot 17 could, in addition or alternatively, include a through groove formed in the end edge 12 of the peripheral wall 11 of the encapsulation cover 9.
    Chip 6 could be any. However, according to the example shown, the chip 6 comprises, in its front face 6b, light radiation sensors 19 and 20 distant from one another longitudinally.
    The encapsulation cover 9 comprises an internal partition 21, projecting from the front wall 10 and joining two opposite sides of the peripheral wall 11.
    The internal partition 21 divides the chamber 13 into two cavities 22 and 23 and straddles the chip 6, in a location such that the sensors 19 and 20 are located respectively on one side and the other and at a distance of the internal partition 21, inside the cavities 22 and 23.
    The internal partition 21 has a rear edge 21a provided with a notch through which the chip 6 passes, this rear edge 21a being fixed on the one hand to areas of the front face 5 of the support plate 2 located on the one hand and on the other side of the chip 6 and on the other hand on zones of the front face 6a and of the sides of the chip 6, by means of a bead of glue 24. Thus, the internal separation partition 21 divides the chamber 13 into two optically separate cavities 22 and 23.
    Inside the cavity 23 is installed an electronic chip 25 glued to the front face 5 of the support plate 2, next to the chip 6. The chip 25 comprises in its front face 25a an emitter of light radiation 26 and is connected to the network of electrical connections 3 by electrical connection wires 27.
    The support plate 2, the encapsulation cover 9, the adhesive bead 14 and the adhesive bead 24 are made of opaque materials.
    The front wall 10 of the encapsulation cover 9 has through holes 28 and 29 which are obstructed by optical elements 30 and 31 allowing the light to pass through, associated respectively with the cavities 22 and 23. The optical elements 30 and 31 can be attached by bonding on a cover 9, prefabricated, or be inserted by overmolding of cover 9.
    The emitter 26 of the chip 25 emits light radiation, for example infrared, towards the outside through the optical element 31. This light radiation present in the cavity 23 is picked up by the sensor 20 of the chip 6. The sensor 19 of the chip 6 captures the external light radiation through the optical element 30 which can be an infrared filter which can form an optical lens for focusing the light towards the sensor 19. The electronic unit 1 can constitute a detection means proximity of a body by processing signals from sensors 19 and 20.
    The local slot 17 opens into the cavity 22.
    As the internal opening of the local slot 17 is small, the light which could penetrate into the cavity 22 through this local slot 17 is not capable of significantly disturbing the light picked up by the sensor 19 as described above.
    However, the housing 1 may include an interior wall 32 which is located between the chip 6 and the interior opening of the local slot 17 and which constitutes an at least partial obstacle to the diffusion in the cavity 22 of the light possibly coming from the local slot 17 towards the sensor 19.
    The material constituting the wall 32 has a low transmittance at the wavelengths to which the optical sensor 19 is sensitive. The absorptions by the low wall and by the walls of the chamber 13 contribute to a strong attenuation of the light coming from the local slit 17.
    As indicated above, the existence of the local slit 17 makes it possible to avoid the formation of cracks in the bead of glue 14, which could allow light to pass through and disturb the light signal detected by the optical sensor 19.
    Advantageously, the interior wall 32 is located near the interior opening of the local slot 17.
    According to the exemplary embodiment shown, the interior wall 32 projects from the front face of the support plate 2.
    The inner wall 32 has ends joined at two locations spaced from the peripheral wall 11 of the encapsulation cover 9, these two spaced locations being located on either side of the local slot 17.
    The height of the interior wall 32 is such that its front edge or top is located in front of the front edge of said local slot 17, that is to say in front of the end edge 12 of the peripheral wall 11 of the encapsulation cover. 9.
    Advantageously, the interior wall 32 is formed by a bead of glue which is extended on the front face 5 of the support plate 2 and which joins portions of the bead of glue 14, adjacent to the ends 15 and 16 of this bead of glue 14 .
    Equivalently, to put the cavity 23 in communication with the outside, a local slot 17a forming a vent is fitted and corresponds to an interruption of the adhesive bead 14 in a corresponding corner, between distant ends 15a and 16a of this bead 14, this local slot 17a including a local groove 18a. An internal wall 32a of glue is also arranged near the interior opening of the local slot 17a.
    The mounting of the encapsulation cover 9 on the support plate 2 can be carried out as follows.
    As illustrated in FIG. 4, beads of glue capable of constituting the bead of glue 14, the walls 32 and 32a and the bead of glue 24 are extended. This operation can be carried out using a syringe whose displacement and flow are controlled.
    Then, the encapsulation cover 9 is placed above the support plate 2, in the position described above, and the adhesive is hardened so as to form the beads of adhesive 14 and 24, which are crushed , while the beads of glue forming the walls 32 and 32a remain intact and have a thickness greater than that of the bead of glue 14.
    According to a variant embodiment, the internal wall could be 5 formed by an internal partition of the encapsulation cover 9, projecting from the front wall 10, the end edge of this internal partition being locally bonded to the front face 5 of the support plate 2, with provision for a local space between the end edge of this internal partition and the front face 5 of the support plate 2.
    权利要求:
    Claims (10)
    [1" id="c-fr-0001]
    1. Housing comprising a support plate (2) having a front face;
    at least one electronic chip (6) mounted on the front face of the support plate;
    and an encapsulation cover (9) of the electronic chip, comprising a front wall (10) extending in front of the electronic chip and a peripheral wall (11) having an end edge fixed on a peripheral zone of the support plate, the support plate and the encapsulation cover delimiting at least one chamber (13) in which the electronic chip is located;
    at least one local slot (17) being arranged between the peripheral wall of the encapsulation cover and the support plate and having an external opening and an internal opening opening into said chamber, so as to put said chamber into communication with the outside .
    [2" id="c-fr-0002]
    2. Housing according to claim 1, comprising a bead of fixing glue (14) interposed between the end edge of the peripheral wall of the encapsulation cover and said peripheral zone of the support plate, this bead having a local interruption including said local slot.
    [3" id="c-fr-0003]
    3. Housing according to one of claims 1 and 2, wherein said local slot (17) includes a local groove (18) formed in the support plate (2) and / or a groove formed in the end edge of the peripheral wall of the encapsulation cover.
    [4" id="c-fr-0004]
    4. Housing according to any one of the preceding claims, comprising at least one interior wall (32) located between the chip (6) and the interior opening of said local slot (17).
    [5" id="c-fr-0005]
    5. Housing according to claim 4, wherein said low wall (32) projects from the front face of the support plate.
    [6" id="c-fr-0006]
    6. Housing according to one of claims 4 and 5, wherein said low wall (32) has ends joined at two locations spaced from the peripheral wall (11) of the encapsulation cover, these two spaced locations being located on the side and on the other side of said local slot (17).
    ίο
    [7" id="c-fr-0007]
    7. Housing according to any one of claims 4 to 6, wherein the front edge of said wall (32) is located in front of the front edge of said local slot (17).
    [8" id="c-fr-0008]
    8. Housing according to any one of claims 4 to 7, wherein said low wall (32) comprises a bead of glue extending on the front face of the support plate.
    [9" id="c-fr-0009]
    9. Housing according to any one of the preceding claims, in which said chip is provided in its front face with at least one optical sensor (19), the front wall of the encapsulation cover having at least one through orifice (28) and being provided with an optical element (28) obstructing this orifice and allowing the light to pass.
    [10" id="c-fr-0010]
    10. Housing according to any one of claims 1 to 8, wherein said chip is provided in its front face with two optical sensors (19, 20), said encapsulation cover being provided with an internal partition of separation (21 ) delimiting two cavities (22, 23) in said chamber (13), inside which are located said sensors; comprising a chip (25) provided with a light emitter (26) placed in one of said cavities; and wherein said front wall (10) of the encapsulation hood (9) has through holes (28, 29) located on either side of the internal partition and is provided with optical elements (28, 29) obstructing respectively these orifices and allowing the light to pass.
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    同族专利:
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    法律状态:
    2018-04-23| PLFP| Fee payment|Year of fee payment: 2 |
    2018-11-23| PLSC| Publication of the preliminary search report|Effective date: 20181123 |
    2019-04-19| PLFP| Fee payment|Year of fee payment: 3 |
    2020-04-22| PLFP| Fee payment|Year of fee payment: 4 |
    2022-02-11| ST| Notification of lapse|Effective date: 20220105 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1754298A|FR3066643B1|2017-05-16|2017-05-16|ELECTRONIC BOX PROVIDED WITH A LOCAL VENT-FORMING SLOT|
    FR1754298|2017-05-16|FR1754298A| FR3066643B1|2017-05-16|2017-05-16|ELECTRONIC BOX PROVIDED WITH A LOCAL VENT-FORMING SLOT|
    US15/978,439| US10651101B2|2017-05-16|2018-05-14|Electronic package with a local slot forming an air-vent|
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